You get the CNC-machined upper board with a 128GB NAND chip pre-soldered. That is the "with hard disk" configuration.
No CPU, baseband, EEPROM or NFC chip is included. Those transfer from your original board.
This is a precision CNC-machined upper motherboard for the iPhone 15 Pro Max. The 128GB NAND flash chip comes pre-soldered — the "with hard disk" configuration. It suits devices with a dead, shorted or water-damaged upper board. You transfer your own working A17 Pro CPU, baseband and EEPROM across. The NFC chip must also move, or the phone boot-loops. Factory-level CNC drilling gives clean, safe pad access for chip transfer. This is the Australian A3106 spec board with the international sub-6 5G layout. US A2849 boards differ — they are eSIM-only with mmWave hardware. Capacity must match — this board suits 128GB devices only. This is a micro-soldering part for trained board-level technicians. Not a complete working motherboard and not an activation-lock bypass.
These faults point to a damaged upper board, not a screen or battery.
Corrosion shorts board layers beyond pad repair.
Board draws no current or shorts on the bench.
Boot loops caused by board faults, not software.
Baseband-side damage kills mobile signal permanently.
Board-level charging faults survive port replacement.
Drop damage cracks traces inside the sandwich stack.
Based at Shop 3A, 152 Woogaroo St, Forest Lake QLD 4078. We do board-level work on our own bench.
Genuine product from verified suppliers. Every board inspected before dispatch.
Orders ship in 2-4 business days from Forest Lake. Anti-static packaging and tracking on every order.
Factory machining removes the riskiest step in a board swap.
CNC machining exposes chip pads cleanly. No hand-grinding slips, no lifted pads.
The storage chip is already reflowed on. One less BGA transfer for your bench.
Quality substrate keeps trace continuity intact. Stable connections after the swap.
This is a bare swap board plus NAND. It is not sold as a working motherboard.
Work through this checklist before ordering.
This is expert-level micro-soldering. Mistakes here are permanent.
Difficulty: expert. Trained board-level technicians only.
Controlled BGA removal and reflow.
Even board heating prevents warping.
CPU and baseband reballing before placement.
Pad inspection and alignment under magnification.
Clean pad prep on both boards.
Current-draw diagnosis and static-safe handling.
Fits These:
Does NOT Fit / Is NOT:
Visit Shop 3A, 152 Woogaroo St, Forest Lake QLD 4078. Micro-soldering done in-house.
Board-level diagnostics and chip transfer on site.
Genuine product from verified suppliers.
2-4 business day dispatch, anti-static packed.
Pay your way — Afterpay and Klarna available at checkout.
You get the CNC-machined upper board with a 128GB NAND chip pre-soldered. That is the "with hard disk" configuration.
No CPU, baseband, EEPROM or NFC chip is included. Those transfer from your original board.
Your original chips are removed with hot air and reballed. They are then reflowed onto this fresh board.
The device identity lives in your chips, so it activates as your phone. This is expert BGA work.
No. The lock follows your original CPU and baseband, which you transfer across. The lock state does not change.
This part repairs physically damaged boards for devices you own. It is not a bypass tool.
On 15-series boards, the NFC chip is tied to the original board set. Leaving it behind causes a boot loop at the Apple logo.
Always move the original NFC chip across with the CPU and baseband.
Yes, if your original CPU and TrueDepth parts stay together. Face ID pairs to those components, not the bare board.
Damage the TrueDepth flex during the job and Face ID is lost. Handle it carefully.
No. The 128GB NAND is soldered and fixed. Capacity cannot be changed by software.
Match the board to the device's original capacity. We can source other capacities on request.
Yes. The Australian model is A3106, and this board matches that spec. It uses the international sub-6 5G layout.
It does not suit the US A2849. That board is eSIM-only with mmWave hardware. For A3105 or A3108 devices, contact us first.
No. The 6.1 inch iPhone 15 Pro uses a different board. Its model numbers are A2848, A3101, A3102 and A3104.
This listing is for the 6.7 inch Pro Max only.
No. Board-level parts carry no warranty. The outcome depends entirely on installer workmanship and heat control.
Every board is bench inspected before dispatch. Check it under magnification before starting any transfer.
Yes. We do board-level micro-soldering in-house at Forest Lake.
Start with a free assessment. Find us at Shop 3A, 152 Woogaroo St, Forest Lake QLD 4078.
Pay your way — Afterpay and Klarna available at checkout.
Every board is inspected before it ships. Visit us at Shop 3A, 152 Woogaroo St, Forest Lake QLD 4078.
We offer multiple convenient payment options for your repairs and accessories purchases. Pay with cash, debit/credit card, or interest-free Buy Now Pay Later options.
All orders require 2-4 business days for processing, regardless of shipping method.
This includes order verification, picking, packing and preparation for dispatch.
You will receive tracking information for all shipped orders and notification when pickup orders are ready for collection.
Standard: 3-7 business days in transit after processing
Express: 1-2 business days in transit after processing
Express shipping only affects delivery time once dispatched, not processing time.
Express shipping does not expedite the 2-4 business day processing time.
$150.00 away from free shipping!
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