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    iPhone 12 Pro Max 128GB Upper CNC Drilled Donor Board A14 Baseband NAND EEPROM Chip Transfer Motherboard JPC MOBILE

    iPhone 12 Pro Max 128GB Upper CNC Drilled Donor Board A14 Baseband NAND EEPROM Chip Transfer

    $0.00 - $0.00
    $0.00
    $89.10
    $89.10 - $89.10
    $89.10
    SKU UPCNC-12PM-128G
    Microsolder Donor Board · Bare CNC Substrate · No Warranty

    iPhone 12 Pro Max 128GB Upper CNC Drilled Donor Board — A14 Bionic, Snapdragon X55 Baseband, NAND & EEPROM Chip Transfer

    Upper half of the iPhone 12 Pro Max stacked sandwich logic board. CNC drilled to factory OEM pad spec for the A14 Bionic platform. Fits A2411 Global, A2342 US, A2410 China, A2412 Japan. Ships configured for 128GB NAND only. Hosts the Apple A14 Bionic CPU and Qualcomm Snapdragon X55 5G modem. Accepts NAND flash and BB EEPROM chip transfer. Used for owner-recovery on water-damaged or board-fault iPhones. Bare substrate with no chips installed. Visually inspected at the Forest Lake bench before dispatch. Anti-static foam packaging and tracked Australia-wide delivery.

    A14 Bionic Compatible Snapdragon X55 5G Baseband 128GB NAND Only 4 Region A-Numbers No Chips Installed
    AU-Wide Tracked Bench Inspected Ships 2-4 Days

    Jump To

    What It Does Use Cases Compatibility Specs JPC vs Cheap FAQ

    Brisbane Technical Hub

    Forest Lake workshop with hot air rework and microscopes. Trained microsolder techs handle CPU and baseband chip swaps in-house. Bring your phone in or order the board for your own bench.

    Authenticity Guaranteed

    CNC drilled to OEM iPhone 12 Pro Max upper-board spec. Verified BGA pad pitch and clean copper traces. Connector positions checked against factory layout before dispatch.

    Reliable Dispatch

    Ships within 2-4 business days in anti-static packaging with foam protection. Tracked delivery australia-wide from Forest Lake. Brisbane metro 1-3 days, capital cities 3-5 days.

    Professional Microsolder Technicians Only

    This part requires advanced board-level repair skills. CPU and baseband BGA reballing need a hot air rework station. A microscope, flux, low-melt solder and reballing stencils are required. Improper installation will permanently damage the chips.

    Not suitable for DIY repair. For chip-swap service, visit our Forest Lake workshop. Address: Shop 3A, 152 Woogaroo St, Forest Lake QLD 4078.

    What This Upper CNC Board Does

    A14 Bionic CPU Swap

    Move the Apple A14 Bionic Application Processor onto this clean board. The CPU carries serial number, IMEI and Apple ID pairing.

    Snapdragon X55 Baseband

    Transfer the Qualcomm Snapdragon X55 5G modem chip. Restores cellular voice, 5G data, LTE fallback and GPS.

    128GB NAND Flash Swap

    Move the 128GB NAND storage chip across. Keeps user data, photos and apps paired to the original CPU. No data wipe required.

    BB EEPROM Transfer

    Swap the baseband EEPROM that stores network calibration data. Holds boot config and board-pairing information.

    Blank CNC Substrate

    Clean CNC drilled PCB with no chips installed. Ready to receive your working components from the donor iPhone.

    OEM Stacked Form Factor

    Drilled to exact iPhone 12 Pro Max upper-board dimensions. Stacked sandwich design with factory connector positions.

    When Is This Board Used?

    Owner Account Recovery — Damaged Board

    Apple ID activation lock is bonded to the CPU chip itself. Owner-recovery scenarios require the original Apple ID credentials. Reballing the original CPU onto a clean substrate restores account access. The owner signs in normally with their Apple ID after the swap.

    Water Damage Recovery

    Liquid corrodes the board's traces but the chips themselves often survive. Transfer the working CPU, baseband, NAND and EEPROM onto this clean substrate. Restores the device with no data loss.

    Board-Level Trace Faults

    Broken vias, lifted pads or shorted lines stop chips talking to each other. Move the still-working CPU and baseband to this blank donor board. The device boots again on the clean substrate.

    Repair Workshop Stock

    Stocking blank CNC boards lets shops accept water-damage and owner-recovery jobs on arrival. Faster turnaround and more repair revenue. Fewer rejected jobs from missing donor stock.

    Microsolder Training Schools

    Practice BGA reballing and reflow technique on real iPhone 12 Pro Max substrates. Ideal for repair-school students. Train on current Apple silicon CPU and baseband workflows.

    Donor Phone Conversion

    Salvage chips from a smashed-screen donor iPhone. Rehost them on a clean blank board to rebuild a fully working device. Common in refurb workflows and parts-recycling shops.

    Compatibility — iPhone 12 Pro Max 128GB ONLY

    iPhone 12 Pro Max (6.7-inch) — 128GB Only

    Upper logic board. Stacked sandwich design. 128GB NAND configuration only.

    International / AU / EU

    A2411

    United States

    A2342

    China / HK Dual SIM

    A2410

    Japan

    A2412

    Does NOT fit:

    Does not fit iPhone 12 Pro (smaller logic board). Does not fit iPhone 12 or iPhone 12 mini. Does not fit iPhone 11 Pro Max or earlier models. Does not fit iPhone 13, 14 or 15 series at all. Does not fit iPhone 12 Pro Max 256GB or 512GB capacity. Does not fit the lower half of the stacked board.

    In The Box

    1x Upper CNC Drilled Donor Board - iPhone 12 Pro Max 128GB

    Chips NOT included. Transfer the A14 Bionic CPU and Snapdragon X55 baseband from your donor board. Also transfer the 128GB NAND flash and BB EEPROM. This is a blank donor substrate only. No flux, solder balls or stencils are supplied.

    Technical Specifications

    Compatible Device

    iPhone 12 Pro Max (6.7-inch) - 128GB

    Board Type

    Upper Logic Board - Blank CNC Drilled Donor

    Storage Configuration

    128GB NAND compatible only

    Model Numbers Supported

    A2411, A2342, A2410, A2412

    CPU / Application Processor

    Apple A14 Bionic (APL1W01) with PoP LPDDR5 DRAM

    Baseband Modem

    Qualcomm Snapdragon X55 5G (SDX55M)

    Chip Sockets Supported

    A14 Bionic CPU. Snapdragon X55 baseband. 128GB NAND. BB EEPROM.

    Manufacturing Method

    CNC drilled to OEM iPhone 12 Pro Max upper-board pad spec

    PCB Construction

    Multi-layer HDI substrate (factory-equivalent)

    BGA Pad Pitch

    Standard iPhone 12 Pro Max factory pitch. Accepts OEM reballing stencils.

    Connector Layout

    Matches OEM upper-half stacked sandwich connector positions

    Chips Pre-Installed

    None - bare blank substrate (chips supplied by technician)

    Skill Level Required

    Advanced microsolder - professional only

    Required Equipment

    Hot air station, microscope, flux, BGA stencil, low-melt solder

    Packaging

    Anti-static bag with foam protection

    Warranty

    No warranty - bare substrate. Performance depends on chips installed.

    Dispatch

    2-4 business days from Forest Lake QLD

    JPC CNC Board vs Cheap Aftermarket Board

    Side-by-side comparison of what you get vs the unverified bargain version.

    Manufacturing Method
    Our Standard
    CNC drilled to OEM iPhone 12 Pro Max upper-board spec
    Cheap Aftermarket
    Hand-cut or recycled boards with inconsistent dimensions
    BGA Pad Alignment
    Our Standard
    Verified pad pitch. Accepts OEM reballing stencils first try.
    Cheap Aftermarket
    Misaligned BGA pads. Chips lift or short during reflow.
    Trace Quality
    Our Standard
    Clean copper traces on factory-spec multi-layer HDI substrate
    Cheap Aftermarket
    Cold or oxidised traces. Random opens after reballing.
    Connector Placement
    Our Standard
    Matches OEM stacked sandwich layout. Board mates first try.
    Cheap Aftermarket
    Off-spec connector positions. Sandwich will not seat cleanly.
    Model Coverage
    Our Standard
    A2411, A2342, A2410, A2412 verified. 128GB only, no guesswork.
    Cheap Aftermarket
    Listed as iPhone 12 series. Capacity and region not verified.
    Tested Before Ship
    Our Standard
    Visual inspection plus pad continuity check at the Forest Lake bench
    Cheap Aftermarket
    No QC. Defects only show up after hours of reballing work.

    Shipping Information

    Forest Lake Dispatch

    • Ships within 2-4 business days
    • Anti-static bag plus foam padding
    • Tracked delivery australia-wide

    Delivery Times

    • Brisbane metro - 1-3 days
    • Sydney and Melbourne - 3-5 days
    • Regional and remote - 5-7 days

    Pickup or visit: Shop 3A, 152 Woogaroo St, Forest Lake QLD 4078. Mon-Fri 9am-5pm. Sat 10am-5pm.

    Pay your way - Afterpay and Klarna available at checkout.

    Frequently Asked Questions

    What is the iPhone 12 Pro Max upper CNC drilled donor board?+

    A CNC drilled donor board is a clean, machined PCB substrate.

    The iPhone 12 Pro Max uses a stacked sandwich logic board.

    An upper half and lower half join via board-to-board connectors.

    This product is the upper half. It arrives with no chips installed.

    A microsolder technician removes working chips from a damaged board. The chips are reballed onto this clean substrate.

    Which chips can I transfer onto this upper board?+

    Four key chips can be transferred onto this upper board.

    The Apple A14 Bionic CPU carries the iPhone serial number and IMEI.

    The Qualcomm Snapdragon X55 baseband chip handles 5G and LTE.

    The 128GB NAND flash chip stores all user data and apps.

    The BB EEPROM chip holds boot config and network calibration data.

    Will this fix my own iCloud-locked iPhone 12 Pro Max?+

    This board is for owner-recovery scenarios only.

    Activation lock is bonded to the CPU chip, not the board itself.

    If your own board is dead, the swap restores your device. You will need your original Apple ID credentials to sign back in.

    You will sign in normally with your original Apple ID after the swap.

    Do not buy this board to bypass activation on a phone you do not own.

    Are any chips pre-installed on this CNC board?+

    No - this is a completely blank donor board.

    No CPU, no baseband, no NAND, no EEPROM are included.

    You must supply the working chips from a donor iPhone 12 Pro Max 128GB.

    The blank board gives you a clean substrate to reball your chips onto.

    What tools are needed for the chip swap?+

    This is advanced board-level repair work.

    You need a hot air rework station with fine nozzles for chip removal.

    A soldering iron with micro-tips is essential for fine work.

    Flux, low-melt solder, BGA balls and a matched reballing stencil are required.

    A stereo microscope helps with accurate chip placement. None of this is suitable for home repair.

    What is the difference between the upper and lower board?+

    The iPhone 12 Pro Max uses a stacked sandwich logic-board design.

    The upper half holds the CPU, baseband, EEPROM and NAND chips.

    It is the brain of the phone - logic and storage live here.

    The lower half handles charging, power management and audio functions.

    This product is the upper half only. We also stock the matching lower board.

    Will this work with a 256GB or 512GB iPhone 12 Pro Max?+

    No - this board is configured for 128GB only.

    Higher-capacity NAND chips have different package and pad layouts.

    Using the wrong-capacity board causes boot failures and activation errors.

    Check capacity in Settings then General then About on the donor phone.

    How do I check my iPhone 12 Pro Max model number?+

    Look on the back of the iPhone in small etched text.

    The model number starts with "Model A" followed by four digits.

    You can also check Settings then General then About on the device.

    Compatible numbers are A2411, A2342, A2410 and A2412 - all 128GB only.

    Can JPC do the chip swap service for me?+

    Yes - bring the phone to our Forest Lake workshop in person.

    Our technicians perform iPhone board-level repairs in-house.

    We use hot air stations, microscopes and OEM-pitch reballing stencils.

    Visit Shop 3A, 152 Woogaroo St, Forest Lake QLD 4078 to discuss your situation.

    Does this CNC board come with a warranty?+

    No warranty is included with blank CNC donor boards.

    The board is a bare substrate with no chips installed.

    Working performance depends entirely on the chips your technician installs.

    Quality of the reball and reflow work also affects the result.

    A chip damaged during removal or reflow is not covered.

    Browse Related Categories

    Repair Tools and Equipment

    The JPC Mobile Quality Seal

    Every CNC drilled donor board is visually inspected at the Forest Lake bench. Packed in anti-static foam and dispatched within 2-4 business days. Real Brisbane stock, not a drop-shipped listing. Visit us at Shop 3A, 152 Woogaroo St, Forest Lake QLD 4078.

    Bench Inspected Anti-Static Packed AU-Wide Tracked Forest Lake Bench

    Payment Options

    We offer multiple convenient payment options for your repairs and accessories purchases. Pay with cash, debit/credit card, or interest-free Buy Now Pay Later options.

    Afterpay Zip Klarna PayPal
    Learn more about our Buy Now, Pay Later options →

    Shipping & Processing Information

    Processing Time

    All orders require 2-4 business days for processing, regardless of shipping method.

    This includes order verification, picking, packing and preparation for dispatch.

    You will receive tracking information for all shipped orders and notification when pickup orders are ready for collection.

    Shipping Methods

    Standard: 3-7 business days in transit after processing

    Express: 1-2 business days in transit after processing

    Express shipping only affects delivery time once dispatched, not processing time.

    Express shipping does not expedite the 2-4 business day processing time.

    iPhone 12 Pro Max 128GB Upper CNC Drilled Donor Board A14 Baseband NAND EEPROM Chip Transfer Motherboard JPC MOBILE

    iPhone 12 Pro Max 128GB Upper CNC Drilled Donor Board A14 Baseband NAND EEPROM Chip Transfer

    $89.10