❓ Frequently Asked Questions
What equipment is needed to install this Charge IC chip?
Installing a Charge IC chip requires professional-grade micro-soldering equipment that significantly exceeds standard phone repair tools. The essential equipment includes a high-quality hot air rework station with precise temperature control ranging from two hundred to four hundred degrees Celsius and adjustable airflow settings for controlled heating of BGA components. A stereo microscope with ten to forty times magnification is absolutely critical for seeing the tiny solder balls and pad connections, as this work cannot be performed with the naked eye or simple magnifying glasses. You'll need a preheating station or bottom heater to gradually warm the PCB and prevent thermal shock that causes board warping or component damage. Precision anti-static tweezers designed for picking up and placing small BGA components are essential, along with quality flux paste to promote proper solder flow during both removal and installation. Solder paste and BGA reballing stencils may be required if the chip needs reballing before installation. Additional supplies include isopropyl alcohol for cleaning flux residue, kapton tape for protecting surrounding components, and a proper ESD-safe workstation to prevent electrostatic discharge damage. Without this complete equipment setup and extensive hands-on training, attempting this repair will almost certainly result in permanent motherboard damage.
Why is there no warranty on IC components?
IC components like the 343S00235 Charge IC are sold without warranty due to the highly specialised nature of installation and the inability to determine fault attribution after the chip has been soldered. When a BGA chip undergoes hot air rework for installation, it experiences extreme thermal stress that can affect functionality regardless of the component's pre-installation condition. If the chip fails to work after installation, there is no reliable method to determine whether the component was defective or whether the installation process caused damage through incorrect temperature profiles, insufficient or excessive solder, bridged connections between pads, lifted pads from the motherboard, or thermal shock to the chip or surrounding components. The condition of the motherboard itself plays a crucial role, including pad integrity, hidden corrosion from previous water damage, and the quality of previous repair attempts. Technician skill level, equipment quality, solder paste quality, and environmental factors like humidity all significantly influence repair success rates. Every IC component we sell is tested before shipping to verify electrical functionality, but once the chip is installed using high-temperature rework processes, the outcome depends entirely on factors outside our control. This no-warranty policy is industry standard for all BGA IC components sold for professional board-level repair.
How do I diagnose if my iPad needs a Charge IC replacement?
Proper diagnosis before ordering a Charge IC is essential because charging issues can stem from multiple components, and replacing the wrong part wastes money while potentially damaging a functional chip. Start by eliminating simpler causes: test with multiple known-good USB-C cables and power adapters, inspect the charging port for debris or physical damage, and try replacing the charging port flex cable which is a much simpler repair. Use diagnostic tools like a USB power meter to measure charging current and voltage, as specific readings can indicate whether the issue lies in the port, Charge IC, or battery. Board-level diagnosis involves using a multimeter to check for shorts around the Charge IC area, measuring voltage rails associated with charging circuitry, and using DC power supply testing to observe boot current patterns. Thermal imaging can identify components running abnormally hot or cold. Symptoms that often point specifically to Charge IC failure include the device showing a charging icon but battery percentage not increasing, excessive heat generation around the charging circuitry area, no response at all when connecting power despite a known-good port, and specific boot current signatures that experienced technicians recognise. If you lack proper diagnostic equipment and experience, consult a professional micro-soldering technician who can properly diagnose the issue before you invest in parts.
Can I replace the Charge IC myself without professional training?
Replacing a Charge IC without professional micro-soldering training is extremely inadvisable and will almost certainly result in permanent, irreparable damage to the iPad motherboard. This is not a beginner, intermediate, or even advanced-level repair, it is one of the most challenging board-level repairs performed on tablets. The 343S00235 is a BGA package component with numerous tiny solder balls underneath that must each form perfect electrical connections with corresponding pads on the motherboard. These connections are completely invisible once the chip is placed, and any issues such as bridged connections, cold solder joints, or missing contacts will cause malfunction or short circuits. The motherboard pads are microscopically small and extremely fragile, easily torn from the board by excessive heat, improper technique, or wrong tool selection. Once pads are lifted or damaged, board repair becomes exponentially more difficult or impossible. Even experienced general repair technicians who handle screen and battery replacements regularly fail at BGA rework without specific micro-soldering training, often destroying several practice boards before achieving consistent success. If your iPad contains important data or has significant value, the cost of having a trained professional perform the repair is always worthwhile compared to destroying the motherboard and losing everything permanently.
Is the 343S00235 the same as other iPad Charge ICs?
No, the 343S00235 is a specific power management integrated circuit designed for particular iPad generations and is not interchangeable with Charge ICs from other iPad models or earlier generations. Apple uses different power management chips across device generations with varying pin configurations, power delivery specifications, and communication protocols that make them device-specific. Earlier iPads used different chips such as the 343S00313, 343S00024, and other variants that are not compatible with the devices listed for this component. Installing an incorrect Charge IC will result in the device not charging, not powering on, or potentially causing electrical damage to other motherboard components due to mismatched voltage or communication signals. When ordering replacement Charge ICs, always verify the exact chip model required by either checking the marking on the existing chip under magnification, cross-referencing reliable repair documentation, or confirming device model numbers. This particular listing covers the 343S00235 which is compatible with iPad 7th, 8th, and 9th generation, iPad Air 3rd, 4th, and 5th generation, iPad Pro 11-inch first through third generation, and iPad Pro 12.9-inch third through sixth generation as listed in the compatibility section. Double-check your specific iPad model number before purchasing to ensure correct compatibility.
What temperature settings should be used for Charge IC replacement?
Temperature profiling for Charge IC replacement requires careful consideration of lead-free solder characteristics, component thermal limits, and board protection. Modern Apple devices use lead-free solder with melting points around two hundred seventeen to two hundred twenty degrees Celsius, so working temperatures must exceed this while staying below thresholds that damage components or the board. A standard approach involves preheating the entire board to one hundred to one hundred fifty degrees Celsius using a bottom preheater to reduce thermal stress and prevent warping of the multi-layer PCB. Hot air is then applied at approximately three hundred fifty to four hundred degrees Celsius with controlled airflow, focusing heat on the target chip while shielding surrounding components with kapton tape or aluminium foil. The chip should be heated evenly until solder underneath fully liquifies, indicated by the chip floating slightly on the molten solder. Removal should be smooth with tweezers, never forced. For installation, the new chip requires proper flux application, precise alignment under the microscope, and controlled heating to reflow solder without damaging the fresh component. These are general guidelines only, as actual settings vary significantly based on specific equipment, ambient conditions, and board construction. Developing proper technique requires extensive practice on donor boards and ideally formal training from experienced micro-soldering instructors.
How should IC components be stored before installation?
Proper storage of IC components before installation is essential for maintaining functionality and ensuring successful repairs. Integrated circuits are highly sensitive to electrostatic discharge, humidity, and physical damage, requiring careful handling from receipt until installation. Keep the IC in its original anti-static packaging until you're ready to perform the repair, as premature removal exposes it to ESD risks and potential physical damage from handling. Store components in a cool, dry environment away from direct sunlight, heat sources, and areas with static electricity buildup like carpeted workspaces. Humidity control is particularly critical for BGA components because moisture absorbed into the package can cause serious problems during high-temperature installation, including a phenomenon called popcorning where trapped moisture expands rapidly and causes internal delamination or solder ball defects. Professional repair facilities in humid climates often bake moisture-sensitive components at low temperatures before installation to drive out absorbed moisture. When handling the IC, always work on an ESD-safe workstation with a grounded wrist strap, use anti-static tweezers for picking up components, and never touch the solder balls or underside of the chip with bare fingers, as oils and contamination interfere with proper solder connections. Store components upright in their original orientation when possible.
What causes Charge IC failure in iPads?
Charge IC failure in iPads typically results from several common causes, with electrical stress from charging accessories being the most prevalent. Using low-quality, counterfeit, or damaged USB-C cables and power adapters can deliver irregular voltage and current spikes that damage the sensitive circuitry within the Charge IC over time. Third-party chargers lacking proper power regulation are particularly problematic, as are damaged cables with internal short circuits or broken conductors. Liquid damage is another major contributor, as even minor moisture exposure can cause corrosion on the chip and its solder connections that may not manifest as failure until weeks or months later. Physical impact from drops can crack solder joints or the chip die itself, especially in devices that have experienced multiple drops throughout their lifespan. Electrical surges from power outlets during storms or in areas with unstable power infrastructure can overwhelm the chip's protection circuits. Manufacturing defects occasionally occur where certain production batches experience higher failure rates. Heat damage from using the iPad while charging in hot environments or from blocked ventilation accelerates component degradation. To prevent future failures after Charge IC replacement, advise users to use only Apple-certified or high-quality USB-C accessories, avoid charging in extreme temperatures, and keep the USB-C port clean and protected from moisture exposure.
Who typically purchases Charge IC components?
Charge IC components are purchased almost exclusively by professional technicians and repair businesses with established micro-soldering capabilities, as this is not a component suitable for DIY consumers or general tablet repair technicians without board-level training and equipment. Our primary customers include independent repair shops that have invested in micro-soldering equipment and training to offer advanced motherboard repairs beyond standard screen, battery, and port replacements. These businesses purchase IC components to repair customer devices with charging failures that cannot be resolved by simpler component replacements. Educational institutions and training facilities teaching micro-soldering and board-level repair courses purchase components for student practice and skill development. Individual hobbyists with electronics engineering backgrounds who have assembled proper equipment for personal projects also purchase these components, typically for practice on donor boards before attempting repairs on devices they need to restore. Refurbishment operations processing large volumes of used iPads sometimes require Charge IC replacements as part of their restoration workflow for units with charging faults. Regardless of the purchaser type, we emphasise that these components require professional installation and should not be purchased by anyone expecting to perform the repair without proper equipment, training, and demonstrated competence in BGA micro-soldering techniques.
What are the shipping options for IC components to Australia?
JPC Mobile Accessories dispatches all IC components from our Brisbane warehouse within two to four business days of order confirmation. Standard shipping delivers within five to seven business days to addresses throughout Australia, covering all capital cities including Sydney, Melbourne, Adelaide, Perth, Hobart, Darwin, and Canberra, as well as regional and rural areas. All IC components are packaged in anti-static ESD-safe bags within protective packaging to prevent electrostatic discharge damage and physical shock during transit, ensuring the component arrives in perfect condition ready for installation. Express shipping is available for faster delivery, providing arrival within two to three business days to major Australian metropolitan areas, which is ideal for professional repair shops needing urgent parts for customer device repairs with pending deadlines. Brisbane and South East Queensland customers often receive orders within one to two business days after dispatch due to proximity to our warehouse location. For local Brisbane repair businesses requiring immediate pickup, orders can be collected at our Forest Lake location at Shop 3a, 152 Woogaroo Street, Forest Lake QLD 4078, typically ready within two hours during business hours. Please call ahead at 0480 039 913 to confirm stock availability before visiting. All orders include tracking numbers sent via email for delivery monitoring.
